Global Advanced Chip Packaging Market 2024–2033

Reports Description

As per the current market research conducted by CMI Team, the global Advanced Chip Packaging Market is expected to record a CAGR of 8.2% from 2023 to 2032. In 2022, the market size is projected to reach a valuation of USD 35.6 billion. By 2032, the valuation is anticipated to reach USD 71.8 billion.

 Semiconductor manufacturing and supplier investments in the next 10 year

Source: According to Semiconductor Industry Association

The Advanced Chip Packaging market refers to the sector encompassing innovative techniques and technologies for packaging and assembling semiconductor chips into devices. It involves various packaging methods, materials, and designs to optimize chip performance, size, and functionality for diverse applications. The market exhibits rapid technological advancements, driven by the demand for smaller, more powerful, and energy-efficient electronic devices.

It involves collaborations between semiconductor manufacturers, packaging companies, and end-user industries to cater to evolving consumer needs. Key trends include the increasing demand for miniaturization, rising complexity of semiconductor devices, expanding adoption of IoT and AI technologies, and the focus on energy efficiency.

Additionally, growing demand for high-performance computing, a shift towards system integration and multi-chip solutions, and continuous innovation further shape the market’s trajectory.

Advanced Chip Packaging Market – Significant Growth Factors

The Advanced Chip Packaging Market presents significant growth opportunities due to several factors:

• High-Performance Computing (HPC): The growing demand for high-performance computing applications, such as data centres, artificial intelligence, and scientific research, presents opportunities for advanced chip packaging companies. HPC applications require chips with higher power densities and improved thermal management, which can be addressed through advanced packaging techniques like 3D packaging and through-silicon vias (TSVs).

• Demand for Miniaturization: The increasing need for smaller, lighter, and more powerful electronic devices drives the demand for advanced chip packaging solutions. These technologies enable the integration of more functionalities into compact form factors, supporting the trend of miniaturization in various industries.

• Rising Complexity of Semiconductor Devices: As semiconductor devices become more advanced and complex, traditional packaging methods may not meet performance requirements. Advanced chip packaging techniques, such as 2.5D and 3D packaging, offer higher interconnect density and improved electrical performance, addressing the challenges posed by intricate semiconductor designs.

• Healthcare and Medical Electronics: The focus on healthcare and medical electronics, especially in light of the COVID-19 pandemic, opens opportunities for advanced chip packaging companies. Developing chips for medical devices, diagnostic equipment, and telemedicine solutions can contribute to the recovery and growth of the healthcare industry, creating a new avenue for the application of advanced chip packaging solutions.

• 5G Technology Deployment: The widespread deployment of 5G technology presents opportunities for advanced chip packaging companies. 5G networks require high-performance and energy-efficient chips to handle increased data speeds and connectivity demands. Advanced chip packaging solutions can help optimize the performance and reliability of 5G-enabled devices, such as smartphones, IoT devices, and communication infrastructure.

• Automotive Electronics: The automotive industry’s rapid adoption of advanced technologies, such as electric vehicles, autonomous driving, and connected cars, creates opportunities for advanced chip packaging. These automotive applications demand robust and reliable packaging solutions to withstand harsh environments and ensure efficient data processing, offering potential growth prospects for chip packaging companies catering to the automotive sector.

Advanced Chip Packaging Market – Mergers and Acquisitions

The Advanced Chip Packaging Market has seen several mergers and acquisitions in recent years, with companies seeking to expand their market presence and leverage synergies to improve their product offerings and profitability. Some notable examples of mergers and acquisitions in the Advanced Chip Packaging Market include:

• Intel Corporation and AMD (2018): In 2018, Intel Corporation and AMD entered into a partnership to collaborate on chip packaging solutions. This strategic alliance aimed to leverage each company’s expertise in semiconductor design and manufacturing, driving advancements in chip packaging technologies for enhanced performance and energy efficiency.

• TSMC and ASE Group (2019): In 2019, Taiwan Semiconductor Manufacturing Company Limited (TSMC) partnered with ASE Group to work on advanced chip packaging solutions. Their collaboration focused on improving packaging techniques like System-in-Package (SiP) and Fan-Out Wafer-Level Packaging (FOWLP) to meet the increasing demand for high-performance and compact electronic devices.

• ASE Group’s Acquisition of AEM Holdings (2018): In 2018, ASE Group (Advanced Semiconductor Engineering, Inc.) completed the acquisition of AEM Holdings Ltd., a semiconductor equipment manufacturer. This acquisition expanded ASE Group’s capabilities in advanced packaging equipment, enhancing their position in the chip packaging market.

• Amkor Technology’s Acquisition of Nanium S.A. (2019): In 2019, Amkor Technology, Inc. acquired Nanium S.A., a Portugal-based advanced packaging company. This acquisition allowed Amkor to strengthen its position in the European market and expand its portfolio of advanced packaging solutions.

These mergers and acquisitions have helped companies expand their product offerings, improve their market presence, and capitalize on growth opportunities in the Advanced Chip Packaging Market. The trend is expected to continue as companies seek to gain a competitive edge in the market.

COMPARATIVE ANALYSIS OF THE RELATED MARKET

Advanced Chip Packaging Market – Significant Threats

The Advanced Chip Packaging Market faces several significant threats that could impact its growth and profitability in the future. Some of these threats include:

• Supply Chain Disruptions: The Advanced Chip Packaging market faces threats from supply chain disruptions, which can arise from various factors such as natural disasters, geopolitical tensions, or unforeseen events like the COVID-19 pandemic. Interruptions in the supply chain can lead to delays in production, shortages of critical components, and increased costs, impacting the market’s efficiency and competitiveness.

• Intense Market Competition: The Advanced Chip Packaging market is highly competitive, with numerous players vying for market share. Intense competition can lead to price wars, reduced profit margins, and challenges in differentiating products, potentially impacting the growth prospects of some companies.

• Intellectual Property Issues: Protecting intellectual property (IP) and preventing its unauthorized use is a crucial concern in the market. Instances of IP infringement or technology theft can harm companies’ competitiveness and undermine their investment in research and development. Ensuring robust IP protection is essential to safeguarding the interests of market players and fostering a healthy competitive environment.

• Rapid Technological Advancements: The fast-paced nature of technological advancements poses a significant threat to the market. As new packaging techniques and materials emerge, older solutions can quickly become obsolete, leading to decreased demand and market share for companies unable to keep up with the latest innovations.

Report Scope

Category-Wise Insights

By Event Type :

• 2.5D Packaging and 3D Packaging: These advanced chip packaging technologies involve stacking multiple chips vertically to optimize performance and reduce form factor. 2.5D packaging uses interposers for chip stacking, while 3D packaging directly stacks chips. The market trend shows increased adoption of 3D packaging for its superior interconnect density and better electrical performance, supporting the demand for compact and high-performance electronic devices.

• Fan-Out Wafer-Level Packaging (FOWLP): FOWLP is a chip packaging technique where chips are redistributed and encapsulated in a single molding compound. FOWLP offers cost-effectiveness and high integration capabilities, making it popular for mobile devices and IoT applications. The market trend indicates growing demand for FOWLP due to its ability to cater to the miniaturization trend and deliver improved electrical performance.

• Flip-Chip Packaging: Flip-chip packaging directly mounts the chip onto the substrate, enabling shorter interconnections and better heat dissipation. Flip-chip packaging is widely employed in high-performance computing and networking applications to improve electrical and thermal performance. It is a popular choice for these fields due to its ability to shorten interconnects and dissipate heat efficiently. The market trend shows increased adoption of flip-chip packaging in consumer electronics, automotive, and AI applications due to its excellent electrical and thermal performance.

• System-in-Package (SiP) Solutions: SiP solutions integrate multiple chips and components into a single package, enhancing performance and compactness. System-in-Package (SiP) solutions provide enhanced functionality and lower power consumption, making them ideal for wearables, medical devices, and communication systems. The market is witnessing an increasing demand for SiP solutions due to the growing need for compact and integrated electronic devices that deliver optimal performance in various applications.

By Packaging

• Ball Grid Array (BGA): BGA is a packaging type where the semiconductor chip is mounted on a substrate, and solder balls beneath the chip facilitate electrical connections. Trends in the market include increasing adoption due to its ability to handle higher I/O counts, enhanced thermal performance, and its suitability for high-density applications like gaming consoles and network devices.

• Quad Flat Package (QFP): QFP is a packaging type with flat leads on all four sides of the package. It is widely used for various ICs due to its ease of manufacturing and cost-effectiveness. The market trends show a gradual decline in usage, mainly due to the increasing popularity of more advanced and compact packaging solutions.

• Chip Scale Package (CSP): CSP is a packaging type that allows chips to be packaged in a size similar to their actual dimensions, minimizing package footprint. Market trends indicate significant growth due to the rising demand for smaller and thinner electronic devices, where CSPs offer space-saving advantages and better thermal performance.

• Wafer-Level Chip Scale Package (WLCSP): WLCSP is a packaging type where individual chips are directly packaged on the wafer level, eliminating the need for traditional packaging processes. Market trends show a strong upward trajectory driven by the demand for miniaturized devices, improved electrical performance, and cost savings achieved through simplified assembly processes.

By End Use Industry

• Electronics: The Advanced Chip Packaging market in electronics involves packaging solutions for semiconductor chips used in consumer electronics, computing devices, and wearables. The trend includes increasing demand for miniaturization, energy-efficient packaging, and higher interconnect density to cater to the growing market for compact and feature-rich electronic devices.

• Telecommunications: The market in telecommunications focuses on chip packaging solutions for 5G technology, high-speed data communication, and network infrastructure. The trend includes developing packaging techniques to support higher data transfer rates, enhanced connectivity, and efficient power consumption in telecommunication devices and systems.

• Industrial: In the industrial sector, the Advanced Chip Packaging market caters to chips used in factory automation, robotics, and IoT devices. The trend includes rugged and durable packaging solutions to withstand industrial environments, enabling seamless data processing, connectivity, and automation in various industrial applications.

• Healthcare: The market in healthcare involves packaging solutions for chips used in medical devices, diagnostic equipment, and telemedicine solutions. The trend includes developing packaging techniques to ensure reliability, precision, and miniaturization, supporting the healthcare industry’s focus on advanced medical technologies and improved patient care.

• Aerospace and Defence: In the aerospace and defence sector, the Advanced Chip Packaging market provides solutions for chips used in avionics, radar systems, and military equipment. The trend includes developing packaging techniques for high-reliability and radiation-hardened chips to meet the stringent requirements of aerospace and defence applications.

• Automotive: In the automotive sector, the Advanced Chip Packaging market provides solutions for chips used in electric vehicles, autonomous driving, and connected cars. The trend includes robust and reliable packaging techniques to withstand harsh automotive environments, ensuring efficient data processing and enhancing vehicle safety and performance.

Advanced Chip Packaging Market – Regional Analysis

The Advanced Chip Packaging Market is segmented into various regions, including North America, Europe, Asia-Pacific, and LAMEA. Here is a brief overview of each region:

• North America: Trend – In North America, the Advanced Chip Packaging market is driven by a focus on technological advancements and innovation. The region has a strong presence of leading semiconductor companies and research institutions, fostering the development of cutting-edge chip packaging techniques and materials. Key players in this region include Intel Corporation, Qualcomm Technologies, Inc., Amkor Technology, Inc., and Texas Instruments Incorporated.

• Europe: Trend – In Europe, the Advanced Chip Packaging market is characterized by a growing emphasis on sustainable and eco-friendly packaging solutions. The region is actively exploring green packaging materials and techniques to reduce environmental impact and meet the demands of environmentally conscious customers. Dominating Market Players – Leading players in the European market include ASML Holding N.V., Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These companies are at the forefront of providing advanced chip packaging solutions tailored to European industries’ sustainability goals.

• LAMEA (Latin America, Middle East, and Africa): In the LAMEA region, the Advanced Chip Packaging market is influenced by increasing investments in infrastructure development and smart city initiatives. The demand for chip packaging solutions for IoT applications, telecommunication infrastructure, and industrial automation drives the market’s growth. Dominating Market Players – Prominent players in the LAMEA market include GlobalFoundries, ON Semiconductor Corporation, Tower Semiconductor Ltd., and South Microelectronics. These companies contribute to the region’s technological advancement through their diverse chip packaging offerings catering to various end-use industries.

• Asia-Pacific: Trend – The Asia-Pacific region experiences a surge in the demand for advanced chip packaging solutions driven by rapid industrialization and the adoption of advanced technologies. The region’s focus on 5G deployment, IoT applications, and smart manufacturing fuels the demand for innovative chip packaging techniques. The major Prominent players in this region includes such as Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung Electronics Co., Ltd., ASE Group (Advanced Semiconductor Engineering, Inc.)

Competitive Landscape – Advanced Chip Packaging Market

The Advanced Chip Packaging Market is highly competitive, with a large number of manufacturers and retailers operating globally. Some of the key players in the market include:

• Intel Corporation
• Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• Advanced Micro Devices Inc. (AMD)
• Samsung Electronics Co. Ltd.
• Amkor Technology, Inc.
• ASE Group (Advanced Semiconductor Engineering Inc.)
• Qualcomm Technologies Inc. (a subsidiary of Qualcomm Incorporated)
• SK Hynix Inc.
• Siliconware Precision Industries Co. Ltd. (SPIL)
• Texas Instruments Incorporated (TI)
• Others

These companies operate in the market through various strategies such as product innovation, mergers and acquisitions, and partnerships. For example, In 2021, Qualcomm Technologies, Inc. and GlobalFoundries entered a major partnership in the Advanced Chip Packaging market.

The collaboration aimed to jointly develop and offer advanced packaging solutions for various semiconductor applications, leveraging the strengths and capabilities of both companies to meet industry demands.

In the Advanced Chip Packaging market, new players are entering the industry with a focus on innovation and development. New players in the Advanced Chip Packaging market are bringing innovative packaging techniques, materials, and solutions to meet the changing needs of different industries. With their new techniques and offers, these growing enterprises hope to meet the market’s changing wants and requirements.

Moreover, key players like Samsung Electronics Co., Ltd., ASE Group (Advanced Semiconductor Engineering, Inc.), and SK Hynix Inc. and Taiwan Semiconductor Manufacturing Company Limited (TSMC)dominate the market. These established players possess extensive expertise, resources, and a wide customer base, enabling them to lead the market with their advanced chip packaging technologies and solutions. Their strong market presence and continuous innovation position them at the forefront of the industry.

The Advanced Chip Packaging Market is segmented as follows:

By Technology

• 5D Packaging, 3D Packaging
• Fan-Out Wafer-Level Packaging (FOWLP)
• Flip-Chip Packaging
• System-in-Package (SiP) Solutions

By Packaging

• Ball Grid Array (BGA)
• Quad Flat Package (QFP)
• Chip Scale Package (CSP)
• Wafer-Level Chip Scale Package (WLCSP)

By End-Use Industry

• Electronics
• Automotive
• Telecommunications
• Industrial
• Healthcare
• Aerospace and Defence

Regional Coverage:

North America

• U.S.
• Canada
• Mexico
• Rest of North America

Europe

• Germany
• France
• U.K.
• Italy
• Spain
• Rest of Europe

Asia Pacific

• China
• Japan
• India
• New Zealand
• Australia
• South Korea
• Rest of Asia Pacific

The Middle East & Africa

• Saudi Arabia
• UAE
• Egypt
• Kuwait
• South Africa
• Rest of the Middle East & Africa

Latin America

• Brazil
• Argentina
• Rest of Latin America