Global Advanced Packaging Market size was valued at USD 37.1 Billion in 2023 and is expected to reach USD 94.4 Billion by 2032, at a CAGR of 10.2% during the forecast period 2023 – 2032.
Advanced Packaging Market – Overview
Advanced packaging encompasses several distinct techniques, such as 2.5D, 3D-IC, fan-out wafer-level packaging, and system-in-package. In comparison to traditional back-end packaging, advanced packaging presents a more valuable and lucrative opportunity within the semiconductor industry.
Key trends in the advanced packaging market include the growing adoption of heterogeneous integration techniques like 2.5D and 3D-IC, driven by demand for compact, high-performance electronic devices. System-in-package (SiP) and fan-out wafer-level packaging are gaining prominence for enhanced functionality and form factor reduction.
The market is witnessing increased collaboration across the semiconductor ecosystem to address integration challenges. Moreover, the rise of applications like 5G, artificial intelligence, and the Internet of Things is fueling the need for advanced packaging solutions, fostering innovation and reshaping the landscape to meet the evolving demands of modern electronics.
Key players in the advanced packaging sector encompass logic and memory integrated device manufacturers (IDMs), foundries equipped with leading or mature node capabilities, and outsourced semiconductor assembly and test (OSAT) companies.
By type, fan out WLP segment held the highest market share in 2022 and is expected to keep its dominance during the forecast period 2024-2032. FO-WLP is increasingly preferred for its superior heat dissipation, enhanced electrical performance, and improved signal integrity.
The technology’s versatility accommodates various chip sizes and types, contributing to its growing adoption. Additionally, FO-WLP’s role in addressing challenges associated with 5G, artificial intelligence, and high-performance computing applications further fuels its prominence, making it a key driver in shaping the advanced packaging landscape.
By end use industry, the consumer electronics segment held the highest market share in 2022. Consumer electronics trends driving the advanced packaging market include the demand for smaller and more powerful devices, such as wearables and compact smart devices.
The rise of 5G technology and increasing functionalities in smartphones propel the need for advanced packaging solutions to accommodate complex chip designs.
By Region, Asia Pacific held the highest market share in 2022 and is expected to keep its dominance during the forecast period. The surge in demand for consumer electronics, especially in countries like China and South Korea, propels the adoption of compact and high-performance packaging solutions.
Collaborations and partnerships among key industry players in Asia-Pacific contribute to technological advancements, driving innovation and growth in the advanced packaging market.
TSMC led the way in pioneering packaging methodologies through its 3DFabric brand, rapidly establishing itself as a major Outsourced Semiconductor Assembly and Test (OSAT) provider for advanced packaging.
TSMC offers cutting-edge system-in-packages like H100, employing technologies such as integrated fan-out (InFO, chip first), and chip-on-wafer-on-substrate to advance packaging solutions.
Report Scope
| Feature of the Report | Details |
| Market Size in 2023 | USD 37.1 Billion |
| Projected Market Size in 2032 | USD 94.4 Billion |
| Market Size in 2022 | USD 34.9 Billion |
| CAGR Growth Rate | 10.2% CAGR |
| Base Year | 2023 |
| Forecast Period | 2024-2033 |
| Key Segment | By Type, End Use Industry and Region |
| Report Coverage | Revenue Estimation and Forecast, Company Profile, Competitive Landscape, Growth Factors and Recent Trends |
| Regional Scope | North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America |
| Buying Options | Request tailored purchasing options to fulfil your requirements for research. |
Custom Market Insights has comprehensively analyzed advanced packaging market. The driving forces, restraints, challenges, opportunities, and key trends have been explained in depth to depict depth scenarios of the market. Segment wise market size and market share during the forecast period are duly addressed to portray the probable picture of this advanced packaging industry.
The competitive landscape includes key innovators, after market service providers, market giants as well as niche players are studied and analyzed extensively concerning their strengths, weaknesses as well as value addition prospects. In addition, this report covers key players profiling, market shares, mergers and acquisitions, consequent market fragmentation, new trends and dynamics in partnerships.
List of the prominent players in the Advanced Packaging Market:
- Amkor Technology
- Advanced Semiconductor Engineering
- Samsung Electronics
- Taiwan Semiconductor Manufacturing Company
- JCET Group
- Intel Corporation
- Texas Instruments
- NXP Semiconductors
- STMicroelectronics
- Infineon Technologies
- Analog Devices
- Microchip Technology
- Rohm Semiconductor
- Qualcomm Technologies Inc.
- Renesas Electronics
- TDK Corporation
- Onsemi
- ChipMOS Technologies Inc.
- Toshiba Corporation
- Powertech Technologies Inc
- Others
The Advanced Packaging Market is segmented as follows:
By Type
- Flip Chip CSP
- Flip-Chip Ball Grid Array
- Wafer Level CSP
- 5D/3D
- Fan Out WLP
- Others
By End Use Industry
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
Regional Coverage:
North America
- U.S.
- Canada
- Mexico
- Rest of North America
Europe
- Germany
- France
- U.K.
- Russia
- Italy
- Spain
- Netherlands
- Rest of Europe
Asia Pacific
- China
- Japan
- India
- New Zealand
- Australia
- South Korea
- Taiwan
- Rest of Asia Pacific
The Middle East & Africa
- Saudi Arabia
- UAE
- Egypt
- Kuwait
- South Africa
- Rest of the Middle East & Africa
Latin America
- Brazil
- Argentina
- Rest of Latin America